Milestones - 2006

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First public presentation of the 2200 evo Twin-Head Multi-Chip Die Bonder
The 2200 evo – new family member of the proven 2200 platform - has its official launching at Semicon China in Shanghai, March 21 – 23, 2006 With the 2200 evo you get it all - evolutionary performance and best cost of ownership.
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