Press Releases 2006

Datacon Technology GmbH appoints H. Fillunger & Co. as New Sales Representative in India December 2006 Press release »
Caleo SLR awarded as Best European Distributor of the Year November 2006 Press release »
Opening of the Datacon "Moving - workout club" October 2006 Press release »
Datacon and EV Group extend cooperation on advanced-chip-to-wafer technology (AC2W) and installed EVG540C2W System October 2006 Press release »
BE Semiconductor Industries Receives Initial Order for RFID Flexible Antenna Plater September 2006 Press release » Download: Press_Release_Meco_FAP.pdf
Open House at Datacon Hungary, September 08, 2006 September 2006 Press release »
Join us at Semicon Taiwan - 11 - 13 September, 2006 August 2006 Press release »
Datacon parts company with loss-making subsidiary in Berlin August 2006 Press release »
Snap Shots from Semicon West July 2006 Press release »
Join us at Semicon West 2006 and "Meet the future of advanced packaging" July 2006 Press release »
Datacon strengthens its commitment to the US market: July 2006 Press release »
World premiere of the new Die Bonder 2200 evo from Datacon at Semicon China: Revolutionary multichip concept with exceptional features March 2006 Press release »
Datacon’s 8800 FC Quantum - boom in demand for the high-speed flip chip bonder March 2006 Press release »
"Meet the Future of Advanced Packaging" - Join us at Semicon Europa, April 04 - 06, 2006, Booth Nr. A3.702 March 2006 Press release »
Visit us at Semicon China 2006! Join Besi and "meet the future of advanced packaging" March 2006 Press release »
RFID World 2006 - Datacon’s 8800 RFID Assembly Line drives the market: New customers in the US, Asia Pacific and Europe benefit from lowest cost-of-ownership March 2006 Press release »