Datacon / About: Flip Chip, dipping fluxer

Datacon Flip Chip pioneer from the very beginning offers you the ideal system for series production in this highly sophisticated technology. The steps flip the component by 180 °, cover it in the dipping unit, position the component can be processed in just one module.

flip chip Solder Bump Process

Solder Bump Process and Polymer Process

flip chip Cycle time

Cycle time of down to 1.0 sec. (w/o upward looking camera, dipping excluded)

flip chip Flux dipping

Flux dipping process

flip chip Underfill process

Underfill process

flip chip Achievable placement accuracy

Achievable placement accuracy up to +/- 10 µm@3Sigma, cmk: 1.33

flip chip Dipping Unit

Dipping Unit gentle and safe

flip chip Slide Fluxer dipping

Slide Fluxer provides a reliable and simple dipping process

FC - Flip Chip