Thanks to Datacon's permanent research and development in the advanced packaging market, we are technological leaders in the field.
This kind of market-orientated research and development enables us to set trends. To keep our firm role as technological leaders in the future, we have a significant number of dedicated research and development staff, and are continually involved in worldwide research and development projects.
Internationally reputable research institutes and semiconductor industry suppliers and manufacturers are working together to achieve innovative technological solutions. This international R&D network secures our trend-setting qualities and gives our entrepreneurial philosophy motivation for the future.
Below a short overview of our actual projects:
HydromelCosy-3DDAVIDSm@rtPackHiding Dies
Completed Projects:
FLEX-SI - Flexible SiliconVSI - Vertical System IntegrationPROKOSMOSFLIBUSIFor additional information, please contact:
Datacon Technology GmbH
Mr. Hannes Kostner
Advanced Technology
Tel.: +43 5337 600-0
E-mail: hannes.kostner@datacon.at