Thanks to Datacon's permanent research and development in the advanced packaging market, we are a technological leader in the field.
Market-orientated research and development enables us to set trends. To keep our firm role as technological leaders in the future, we have a significant number of dedicated research and development staff, and are continually involved in worldwide research and development projects.
Internationally reputable research institutes and semiconductor industry suppliers and manufacturers are working together to achieve innovative technological solutions. This international R&D network secures our trend-setting qualities and gives our entrepreneurial philosophy motivation for the future.
Below a short overview of our current projects:
HydromelCosy-3D3DICECOCOAChip2FoilCompleted Projects:
DAVIDFlexILVIASm@rtPackHiding DiesFLEX-SI - Flexible SiliconVSI - Vertical System IntegrationPROKOSMOSFLIBUSIFor additional information, please contact:
Datacon Technology GmbH
Mr. Hannes Kostner
Director Research and Development
Tel.: +43 5337 600-0
E-mail: hannes.kostner@besi.com