EV Group, a leading supplier of wafer-bonding and lithography equipment, and Datacon Technology AG,
leading supplier of flip chip and die bonding equipment, announce a development agreement in
the field of advanced-chip-to-wafer technology (AC2W). The two companies also have agreed on joint
strategic marketing and sales activities to promote the
cooperation.
The unique technology combines Datacon's leading expertise in chip-bonding and key flip-chip bonding technologies with the unique wafer-level know-how from EV Group. It has been developed in a joint R&D project.
The new equipment platform has already been successfully installed at Infineon AG, a major semiconductor device manufacturer.
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Press ReleaseFolderFor additional information, please contact:
Datacon Technology GmbH
Mr. Hannes Kostner
Advanced Technology
Tel.: +43 5337 600-0
E-mail: hannes.kostner@datacon.at