This project was established in collaboration with industrial and academic research centres to create an innovative, highly secure and portable intelligent system that will facilitate advanced telephony, multimedia, secure transactions and enterprise access. It can be considered a logical continuation of the current Sm@rtPack PIDEA+ project, whose axes of development is, amongst other things, chip-on-wafer “Face Connected Die Stacking” and which is in its pilot phase.
The COSY-3D project allows for a huge evolution of the Sm@rtPack technology, enlarging the heterogeneous compact module through vertically integrated components in order to secure compact portable products.
Start of project: January 2008
End of project: December 2010