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| High Density Integration of Dies into Electronics Substrates |
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The "HIDING DIES" project aims to develop a highly innovative technology for embedding active chips into high-density printed circuit boards (PCB's). This 3D-dimensional integration will enable a high degree of miniaturization and improve electrical and thermal performance for mobile and communication products. The technological concept is to embed thin chips (50 µm and less) into laminated build-up layers and to generate interconnections using PCB technology. |
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Datacon, the pioneer in the fields of flip chip, chip stacking, and thin chip handling, is therefore working jointly with well-known top European companies and research centers to develop a technology suitable for mass-production use for embedding chips on printed circuits. |
