This project aims at developing new packaging techniques suitable
for future generation of smart-cards according to key market
requirements expressed by business operators. The results
of the project will be used in several market segments:
  • High-storage capabilities in the Mobile Telco segment,
    paving the way to offer new highvalue services to
    subscribers
  • High-security in the Pay-TV and ID areas, by offering
    active protection technologies preventing extensive
    hacking of cards by individuals or criminal
    organizations, thus preserving the rights of
    premium-content owners.
  • Long-life and high durability in the Public Sector (ID),
    by decreasing the total cost for smartcard infrastructure
    for governmental operators, and by helping user
    acceptance.
  • Reliable and low cost technology in transportation area,
    where ease of use, infrastructure costs and speed
    have to be optimized.
The technological keys explored in the project will be
focused in two different areas:
  • Chip-stacking: The goal is to enhance the actual
    functionalities of smart card embedded microprocessor
    by using new die(s)-on-wafer stacking technologies,
  • High-reliability contact-less assemblies: The goal is to
    penetrate the emerging identity/access control markets
    by proposing a very thin contact-less card/device (< 300µm).
    In these markets, low cost, robustness, reliability and
    high durability must be the essential characteristics
    of the final product.

Download SmartPack Poster [PDF]
Time Schedule:
Start: January 2005
End: December 2007
Further Information available on request:
Hannes Kostner