The 2200 apm Multi Chip Die Bonder is the current industry standard based on Datacon's previous PPS 2200 Multi Chip Die Bonder platform, a revolutionary modular system introduced in 1995. The Datacon 2200 apm provides users with extraordinary flexibility with minimum space requirements. Whatever connection technologies you choose (flip chip, die attach, or a combination of both) the conversion between different applications is done fast and simply. The 2200 apm was developed specifically for the demanding advanced packaging market.
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