 Wafermapping |
 Postbond Inspection |
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Wafermapping - With the help of wafer mapping, a time-optimized and quality-selective processing of the wafer is achieved by the way of the stored chip-quality classes |
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Substrate mapping - This software option determines the bonding location on the target wafer or substrate for chip-on-wafer applications |
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Postbond Inspection - The programmable post dispense or post bond inspection ensures your process quality. |
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Traceability - Datacon helps you to keep track of your production flow |
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Pattern Recognition - Datacon has more than 10 years of experience in PRS and guarantees a better control of the process. Different search modes are available, such as edge-, pattern-, circular-, center of gravity recognition or double search. |
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Z-Positional Bonding - for a higher process safety even with large height tolerances of substrates or dies |
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Fully Synchronized Ejection - for a very sensitive chip handling during the ejection/picking from wafers by fully synchronized movement of pickup-head and ejector-system |