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With the globally unique platform concept up to 4 modules can be arranged consecutively - UPH can be optionally multiplied
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Multi Chip Module - Flip Chip and Die attach tasks can be executed in just one module
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Small Footprint - 2200 apm has a footprint of just 0.96m²
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Key Specifications
Die handling from 0.17 mm up to 25mm (optionally up to 35 mm)
Placement accuracy of 10µm@3Sigma, cmk: 1.33
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Operator Friendly - Despite the wide range of fittings and set-up options, operation of the 2200 apm is easy to learn. Data transfer via the TCP/IP network is naturally ipmlemented and the user interface is menu-driven.
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Flexibility
Even the standard module of Datacon die bonders can be very variably equipped
Due to offline programming the time saving achieved on programming at the production machine is between 50 and 75%
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