Process of epoxy, flux and solder paste

«back
Dispensing System - Spindle Dispenser and Time/Pressure Dispenser available. Free programmable dispense pattern.
Adhesive stamping reservoir – Our speed programmable rotary squeegee offers an adjustable adhesive thickness.
Dipping unit - offers programmable flux height for different bump sizes during a FC process with a usage of low viscosity flux
Slide Fluxer - provides a reliable and simple dipping process