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The 2200 apm+ is fully integrated in Datacon´s unique platform concept.
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300 mm Wafer processing In the loading and unloading of the 2200 apm+ with 300 mm wafer magazines, special attention was paid to the SEMI-compliant design of the transfer height.
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Multi Chip Module In just one module, the 2200 apm+ can flip the die, dip it in the dipping unit, and accurately place the component . Flip Chip and die attach or any combination of these are also possible, as placing various chips on a substrate on top of or next to each other all in one module!
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Small Footprint - 2200 apm+ has a footprint of just 1000 x 1200 x 1800 mm
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Key Specifications
Die handling of between 0.25 mm and 50 mm edge length
Placement accuracy of 10 µm@3Sigma, cmk: 1.33
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Operator Friendly Despite the wide range of fittings and set-up options, operation of the 2200 apm is easy to learn. Data transfer via the TCP/IP network is naturally implemented and the user interface is menu-driven.
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Flexibility
Even the standard module of Datacon die bonders can be very variably equipped
Due to offline programming the time saving achieved on programming at the production machine is between 50 and 75%
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