With its 8800 FC Smart Line, Datacon offers you a flip chip bonder with the highest throughput, extreme precision and 100% final inspection and test, all on the smallest footprint. The 8800 FC Smart Line seamlessly integrates three machine modules: the 8800 FC Smart Line Flip Chip Bonder with integrated dispenser, the curing station with integrated electrical test, and the optical inspection and reject-marking unit.
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 Best New Product in the Flip Chip Attach Equipment & Material Category for 8800 FC Smartline |