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Transfer 300 to 200mm wafer frames |
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Sorting from Wafer to Wafer,
Waffle-Pack/Gel-Pack and Tape&Reel |
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LED wafers output to 32 bins |
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Wafer to Die Trays |
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Vision inspection of devices |
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Pick and Place at up to 9000 uph |
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Die as small as 200µm square |
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Large µ Processor die over 25mm square |
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Electronic wafer map input |
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25 level wafer cassette input |
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25 level frame cassette output |
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Edge Chip and 2D Bump inspection |
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Standard 255 bin categories |
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Windows® XP |
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Network Ready LED Wafer Processing |
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Pick up to 32 bins and transfer to film frames |
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Adaptive wafer alignment and die pitch correlation software |
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Vision inspect for doublets and
die chips / cracks |
