Precision Flip Chip Die Bonder
 |
Placement Accuracy of ±0.5 Micron |
|
Forces up to 200 Kg |
|
Temperatures up to 500 Degrees Celsius |
|
Split Optics System |
|
Pattern Recognition |
|
Ultrasonics |
|
Closed Loop Feedback Temperature and Force Maintenance |
|
Motorized Stages |
|
Windows XP |
|
FPA, Optoelectronics, FPA, MEMS, 3D Stacking |
The low cost, small footprint solution for ultra, high precision flip chip die bonding. With the most basic system configuration, the M9 Series will allow you to perform cold compression, thermocompression, adhesive cure, and solder reflow, all without the need for hardware changes.
Download M9 Datasheet
For Sales in the US please
contact Laurier directly under www.laurierinc.com