CS1250

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High Speed Die Sorter for WLP and other Flipped Devices into Tape and Reel Throughput: 16,000 UPH Footprint: 1.95m2 (1.65m W x 1.16m D) Placement Accuracy: 25µm@3s Wafer Size: 300mm standard, 200mm capable Die Size: 0.5mm X 0.5mm to 12.5mm X 12.5mm Tape Width: 8mm to 24mm Automatic tape load and tape width adjustment Automatic calibration and drift correction Single touch screen Graphical User Interface 2D Vision inspection for bump damage, edge chips, lasermarks, surface defects and tape seal