Datacon - flip chip pioneer from the very beginning - offers you the ideal system for series production and R&D laboratories in this highly sophisticated technology. The three steps, namely flip the component by 180°, cover it in the slide fluxer, and bond it to the desired position on the substrate, can be processed in just one module.
 | Solder bump and polymer process |
| Cycle time approx. 0,6 sec. (w/o up-looking camera, w/o dipping) |
| Flux dipping process |
| Underfill process |
| Achievable placement accuracy up to ±10 µm @ 3s (cmk=1,33) |
