With the globally unique platform concept up to 4 axis systems (dispensing and bonding) can be arranged consecutively to a single machine - UPH can be optionally multiplied.
 | Multi-chip module - Flip chip and die attach tasks can be executed in just one module |
| Small footprint - 2200 evo only requires 1,4 m2 of (clean room) floor space |
| Key specifications Die handling from 0,17 mm - 50 mm, Placement accuracy of ±10 µm @ 3s (cmk = 1,33) |
| Operator friendly - Despite the wide range of fittings and set-up options, operation of the 2200 evo is easy to learn - just as used for the 2200 platform. Data transfer via TCP/IP networks is naturally implemented, and the user interface is menu-driven. |
| Flexibility - Even the standard module of the 2200 evo die bonders can be very variably equipped. |
| Extended epoxy features - Next to flux film application via slide fluxer an (optionally) integrated dispense axis enables parallel dispensing and bonding in just one module with significant UPH increases for a multitude of different applications. |
| Heated options - Heated bond head (up to 350 °C) and substrate heating (up to 150 °C) are available to cover today's and tomorrow's demands of heat-requiring applications. |