 |  | Wafer mapping - With the help of wafer mapping, a time-optimized and quality-selective processing of the wafer is achieved by the way of the stored chip-quality classes. Datacon recommends Kinesys ALPS®. |
| Substrate mapping - This software option determines the bonding location on the target wafer or substrate for chip-on-chip wafer. | |
| Single component tracking - Enables to track and trace processed components from different lots to different substrates. | |
| CAD download - up-load bonding programs from remote work stations. | |
 | | Pattern recognition - Datacon has more than 15 years of experience in pattern recognition systems and guarantees an enhanced control of the process. Different search modes are available, such as edge, pattern, circle, bump or center of gravity recognition (just to name a few). |