The stacked die technology is based on the idea to get a significant "size-to-function" reduction for the new generations of electronic products. Just the advance in the thin chip processing and the multi stack package development, made an 8-stacked-multi-chip happen. Target is to get a size reduction as well in XY and as in Z dimension.
 |  | Relative placement capability |
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| Thin chip capability |
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| Die tilt control |
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| BLT control |
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| Bleed out control |
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| Multi adhesive applications in single pass capability |
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| Multi-chip capability in single pass application |
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