Datacon as a leading equipment supplier in the advanced packaging technology is offering you the ideal solution as well for your die attach applications as for your Flip Chip applications.
Epoxy dispensing processAdhesive stamping reservoirWafer size up to 12” (300mm) |
Wafer-, Waffle-, Gel- Pak-, Tape- Surftape-, -capability |
Cycle time down to 1.0 sec.