Datacon Flip Chip pioneer from the very beginning offers you the ideal system for series production in this highly sophisticated technology. The steps flip the component by 180 °, cover it in the dipping unit, position the component can be processed in just one module.
Solder Bump Process and Polymer Process |
Cycle time of down to 1.0 sec. (w/o upward looking camera, dipping excluded) |
Flux dipping processUnderfill process |
Achievable placement accuracy up to +/- 10 µm@3Sigma, cmk: 1.33 |
Dipping Unit gentle and safeSlide Fluxer provides a reliable and simple dipping process