With all its special requirements and processes the opto-market is a new challenge for Datacon. With Datacons flexible platform concept and a strong team of experts Datacon is able to guarantee a perfect component processing (components down to 0.170 µm from wafer, Gel- and waffle-pack) and handling of a wide range of substrate and package types (laminate strips, boards, ceramics, leadframe as well as boats or customized carriers). Datacon goes Opto and changes your manual-or semi automated production into a fully automated solution.Various Processes
Epoxy bondingSingle & Multi Flip Chip processingSingle & Multi Chip attach processingHot & Cold processingSnap curingDispensingDipping/Fluxing