System in Package is almost an advanced variation of a MCM application. The general difficulty is the handling of the very sensitive GaAs (Gallium Arsenid) Chips and the very tight tolerances of the BLT (Bond-Line-Thickness) especially for RF-Devices.
Synchronised ejection |
Achievable Bondforce from 0-1200 gr. (0-120 N) with our ULT (Ultra Light Tool) |
Z-positional bonding