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The stacked die technology is base on the idea to get a significant “size-to-function ”- reduction for the new generation of electronic products. Just the advance in the thin chip processing and the multi stack package development, made an 8-stacked-multi-chip-package happen. Target is to get a size reduction as well in x/y as in z dimension.
 Relative placement capability
Thin chip capability
Die tilt control
BLT control
Bleed out control
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Multi adhesive applications in single pass capability |
Multi Chip capability in single pass application
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