The industrial trend goes more and more to thin wafers/chips. Driven by the miniaturisation of the microelectronic, to be used in e.g. hearing aids, mobile phones, chips in foil, chip in paper, etc.Thin Dies are also needed for stacked applications due to package thickness reduction.
A lot of industrial - and consumer electronic will be miniaturised in the future.
Parallel to this, thin chips are more and more economical due to heat transmission.
Very sensitive chip handling during pick ‘n placeDedicated bonding tooling for pick ‘n placeSoft chip takeoverFully Synchronized ejectionFree programmable slow movement