A transfer tape forms an adhesive layer that is already applied to the wafer. After lifting a component from the wafer foil, the component is bonded together with the adhesive onto the substrate. This has the advantage of an exact adhesive thickness and constant adhesive flow. At the same time, it avoids the work step of applying adhesive to the substrate. The application area for transfer tapes is above all in the field of die attach.
Substrateheating