Datacon's 8800 FC Smart Line

High Versatility

The market of RFID chip attach comprises two worlds: Direct chip attach (attaching the chip directly on an antenna web) and Indirect chip attach (attaching the chips onto an interposer/strap, which is subsequently mounted onto the antenna). There are a lot of different interconnection possibilities: FC soldering (C4, GBS-gold bump soldering) and adhesive FC bonding (NCP, ACP).
In a surrounding of emerging technologies the Datacon 8800 FC Smart Line is the constant factor - flexible enough to deal with all kinds of chips, substrates and interconnection technologies - and versatile enough to keep up with future changes in main stream RFID Production.

Complete Reel to Reel Solution

Datacon's 8800 FC Smart Line is a complete equipment solution based on reel to reel production. After spooling up the product is finished - optionally tested and provided with bad marks for the rejects. Datacon's skilled process and application engineers can help setting up the process and train operators.

Process Reliability

The heart of the 8800 FC Smart Line is the 8800 FC Quantum flip chip bonder, proven equipment in high volume production. It provides dispense and fluxing capability, flip chip pick & place and inspection capability. To achieve to speed without impacting process time the 8800 FC platform is equipped with two independent assembly systems comprising two flip units picking the dies from one wafer, two bond head, two dipping units and two substrate and upward looking camera systems. This unique concept established Datacon's key to high speed process reliability: "Don't sacrifice process time to guarantee process stability".

8800 FC Smart Line - drives down chip assembly costs

The 8800 FC Smart Line is designed for both RFID direct chip attach and indirect chip attach. Around the 8800 FC flip chip bonder with highest through put and accuracy, an integrated high speed dispenser and a heated press form and a perfect production line.

Highlights

	Integrated dispensing system
	Post-dispense inspection
	Dual-head bonding system
	25 slot SEMI standard wafer magazines
	Thermo-controlled heated press
	Spooler system
	Wafer mapping according to SEMI standard with ALPS® conversion licence

Core Specifications

	Direct and indirect chip attach (both strap and antenna web)
	NCP, ACP, Soldering (C4,GBS)
	Heated gang press
	Up to 10,000 UPH
	40 µm @ 3s
	Endless substrate, up to 15" width
	High speed dot or volumetric dispensing
	Post dispense, post bond inspection

Datacon's and Meco's joint RFID solution