Our brand new Twin-Head Multi-Chip Die Bonder offers you two machines in just one compact module.
The 2200 evo is your ideal bonder for high end die attach applications like LEDs, Hybrids, SiPs (System in package), CMOS applications, Stacked Die applications or Power Devices.
Datacon was founded in 1986 and since the beginning of 2005 has been part of the Dutch Besi group (BE Semiconductor Industries N.V.), an international group of companies operating in the semiconductor industry. (Laurier, Meco, Fico)
|
Thanks to Datacon's permanent research and development in the advanced packaging market, we are technological leaders in the field.
Below a short overview of our actual projects:
DAVID (Official website: www.david-project.eu)
Smart Pack
Hiding Dies
SMT/HYBRID/PACKAGING 2007
|